MCF5473ZP200 vs MCF5471ZP200 feature comparison

MCF5473ZP200 Freescale Semiconductor

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MCF5471ZP200 NXP Semiconductors

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Rohs Code No No
Part Life Cycle Code Obsolete Not Recommended
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC NXP SEMICONDUCTORS
Part Package Code BGA
Package Description 27 X 27 MM, MS-034AAL-1, PBGA-388 27 X 27 MM, MS-034AAL-1, PBGA-388
Pin Count 388
Reach Compliance Code not_compliant unknown
ECCN Code 5A002 5A002.A.1
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66.66 MHz 66.66 MHz
External Data Bus Width 32 32
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B388 S-PBGA-B388
JESD-609 Code e0 e0
Length 27 mm 27 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 388 388
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA388,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.55 mm 2.55 mm
Speed 200 MHz 200 MHz
Supply Voltage-Max 1.58 V 1.58 V
Supply Voltage-Min 1.43 V 1.43 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead/Silver (Sn/Pb/Ag) Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 40
Width 27 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Factory Lead Time 13 Weeks

Compare MCF5473ZP200 with alternatives

Compare MCF5471ZP200 with alternatives