MCF5473VR200 vs MPC8245LVV300D feature comparison

MCF5473VR200 Freescale Semiconductor

Buy Now Datasheet

MPC8245LVV300D NXP Semiconductors

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC NXP SEMICONDUCTORS
Part Package Code BGA
Package Description 27 X 27 MM, MS-034AAL-1, PBGA-388 35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, TBGA-352
Pin Count 388
Reach Compliance Code compliant compliant
ECCN Code 5A002 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66.66 MHz 66 MHz
External Data Bus Width 32 32
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B388 S-PBGA-B352
JESD-609 Code e1 e1
Length 27 mm 35 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 388 352
Operating Temperature-Max 70 °C 105 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Equivalence Code BGA388,26X26,40 BGA352,26X26,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260 245
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.55 mm 1.65 mm
Speed 200 MHz 300 MHz
Supply Voltage-Max 1.58 V 2.1 V
Supply Voltage-Min 1.43 V 1.7 V
Supply Voltage-Nom 1.5 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL OTHER
Terminal Finish TIN SILVER COPPER Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 30
Width 27 mm 35 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Samacsys Manufacturer NXP

Compare MCF5473VR200 with alternatives

Compare MPC8245LVV300D with alternatives