MCF5472ZP200 vs XPC8240LZU200B feature comparison

MCF5472ZP200 Freescale Semiconductor

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XPC8240LZU200B Motorola Mobility LLC

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC MOTOROLA INC
Part Package Code BGA BGA
Package Description 27 X 27 MM, MS-034AAL-1, PBGA-388 LBGA, BGA352,26X26,50
Pin Count 388 352
Reach Compliance Code not_compliant unknown
ECCN Code 5A992 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66.66 MHz 66 MHz
External Data Bus Width 32 32
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B388 S-PBGA-B352
JESD-609 Code e0
Length 27 mm 35 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3
Number of Terminals 388 352
Operating Temperature-Max 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Equivalence Code BGA388,26X26,40 BGA352,26X26,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.55 mm 1.65 mm
Speed 200 MHz 200 MHz
Supply Voltage-Max 1.58 V 2.625 V
Supply Voltage-Min 1.43 V 2.375 V
Supply Voltage-Nom 1.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Lead/Silver (Sn/Pb/Ag)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 27 mm 35 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1

Compare MCF5472ZP200 with alternatives

Compare XPC8240LZU200B with alternatives