MCF5472VR200
vs
STPCD0110BTC3
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
STMICROELECTRONICS
Part Package Code
BGA
BGA
Package Description
27 X 27 MM, MS-034AAL-1, PBGA-388
35 X 35 MM, PLASTIC, BGA-388
Pin Count
388
388
Reach Compliance Code
unknown
not_compliant
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
NO
Clock Frequency-Max
66.66 MHz
100 MHz
External Data Bus Width
32
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B388
S-PBGA-B388
JESD-609 Code
e1
e0
Length
27 mm
35 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
Number of Terminals
388
388
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
260
Qualification Status
COMMERCIAL
Not Qualified
Seated Height-Max
2.55 mm
2.38 mm
Speed
200 MHz
100 MHz
Supply Voltage-Max
1.58 V
3.6 V
Supply Voltage-Min
1.43 V
3 V
Supply Voltage-Nom
1.5 V
3.3 V
Surface Mount
YES
YES
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Width
27 mm
35 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR
Base Number Matches
3
1
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Package Equivalence Code
BGA388,26X26,50
Technology
CMOS
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