MCF5470VR200
vs
XPC8245LZU266B
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Not Recommended
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
MOTOROLA INC
Package Description
27 X 27 MM, MS-034AAL-1, PBGA-388
LBGA, BGA352,26X26,50
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Factory Lead Time
13 Weeks
Samacsys Manufacturer
NXP
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
66.66 MHz
66 MHz
External Data Bus Width
32
32
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B388
S-PBGA-B352
JESD-609 Code
e1
Length
27 mm
35 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
3
Number of Terminals
388
352
Operating Temperature-Max
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.55 mm
1.65 mm
Speed
200 MHz
266 MHz
Supply Voltage-Max
1.58 V
1.9 V
Supply Voltage-Min
1.43 V
1.7 V
Supply Voltage-Nom
1.5 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Width
27 mm
35 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
2
3
Part Package Code
BGA
Pin Count
352
Additional Feature
ALSO OPERATES AT 2V SUPPLY
Package Equivalence Code
BGA352,26X26,50
Compare MCF5470VR200 with alternatives
Compare XPC8245LZU266B with alternatives