MCF54450VM240J
vs
XPC823CVR66B2T
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
FREESCALE SEMICONDUCTOR INC
|
Package Description |
MAPBGA-256
|
23 X 23 MM, 1.27 MM PITCH, PLASTIC, BGA-256
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.A.2
|
3A991
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
14
|
32
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
External Data Bus Width |
16
|
32
|
Format |
FIXED POINT
|
FIXED POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
Length |
17 mm
|
23 mm
|
Low Power Mode |
YES
|
YES
|
Moisture Sensitivity Level |
3
|
3
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
BGA
|
Package Equivalence Code |
BGA256,16X16,40
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.6 mm
|
2.35 mm
|
Speed |
240 MHz
|
66 MHz
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER OVER NICKEL
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
Width |
17 mm
|
23 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
1
|
1
|
Part Package Code |
|
BGA
|
Pin Count |
|
256
|
JESD-609 Code |
|
e1
|
Supply Voltage-Max |
|
3.6 V
|
Supply Voltage-Min |
|
3 V
|
Supply Voltage-Nom |
|
3.3 V
|
|
|
|
Compare MCF54450VM240J with alternatives
Compare XPC823CVR66B2T with alternatives