MCF54450VM240
vs
MCF5235CVM100
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Not Recommended
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
NXP SEMICONDUCTORS
Part Package Code
BGA
Package Description
17 X 17 MM, ROHS COMPLIANT, MAPBGA-256
ROHS COMPLIANT, MAPBGA-256
Pin Count
256
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
5A002.A.1
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
24
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
60 MHz
75 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
Length
17 mm
17 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
3
Number of Terminals
256
256
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
1.6 mm
Speed
240 MHz
100 MHz
Supply Voltage-Max
1.65 V
1.6 V
Supply Voltage-Min
1.35 V
1.4 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER OVER NICKEL
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
40
Width
17 mm
17 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
2
4
Factory Lead Time
2 Days
Samacsys Manufacturer
NXP
Additional Feature
LOW POWER MODE TAKEN FROM LOW POWER MODE
JESD-609 Code
e1
Compare MCF54450VM240 with alternatives
Compare MCF5235CVM100 with alternatives