MCF54450VM240
vs
XPC850CZT50B
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
MOTOROLA INC
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Factory Lead Time
13 Weeks
Samacsys Manufacturer
NXP
Address Bus Width
32
26
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
60 MHz
50 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e1
e0
Length
17 mm
23 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
Number of Terminals
256
256
Operating Temperature-Max
70 °C
95 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
BGA
Package Equivalence Code
BGA256,16X16,40
BGA256,16X16,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
2.35 mm
Speed
240 MHz
50 MHz
Supply Voltage-Max
1.65 V
3.465 V
Supply Voltage-Min
1.35 V
3.135 V
Supply Voltage-Nom
1.5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Width
17 mm
23 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR, RISC
Base Number Matches
1
3
Part Package Code
BGA
Package Description
BGA, BGA256,16X16,50
Pin Count
256
Compare MCF54450VM240 with alternatives
Compare XPC850CZT50B with alternatives