MCF54450CVM180 vs XPC850DECZT80B feature comparison

MCF54450CVM180 Freescale Semiconductor

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XPC850DECZT80B Motorola Mobility LLC

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC MOTOROLA INC
Part Package Code BGA BGA
Package Description 17 X 17 MM, ROHS COMPLIANT, MAPBGA-256 BGA, BGA256,16X16,50
Pin Count 256 256
Reach Compliance Code compliant unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 26
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 60 MHz 40 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
Length 17 mm 23 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3
Number of Terminals 256 256
Operating Temperature-Max 85 °C 95 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA BGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 2.35 mm
Speed 180 MHz 80 MHz
Supply Voltage-Max 1.65 V 3.465 V
Supply Voltage-Min 1.35 V 3.135 V
Supply Voltage-Nom 1.5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER OVER NICKEL Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 17 mm 23 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
JESD-609 Code e0

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