MCF54450CVM180 vs MCF5233CVM150 feature comparison

MCF54450CVM180 Freescale Semiconductor

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MCF5233CVM150 Freescale Semiconductor

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description 17 X 17 MM, ROHS COMPLIANT, MAPBGA-256 ROHS COMPLIANT, MAPBGA-256
Pin Count 256 256
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2 5A992
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP NXP
Address Bus Width 32 24
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 60 MHz 75 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
Length 17 mm 17 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 256 256
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.6 mm
Speed 180 MHz 150 MHz
Supply Voltage-Max 1.65 V 1.6 V
Supply Voltage-Min 1.35 V 1.4 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER OVER NICKEL TIN SILVER COPPER OVER NICKEL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 40
Width 17 mm 17 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 2
Additional Feature LOW POWER MODE TAKEN FROM LOW POWER MODE
CPU Family COLDFIRE
RAM (bytes) 65536
Supply Current-Max 150 mA

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