MCF54416CMJ250 vs 79RC32V334-133BBI feature comparison

MCF54416CMJ250 NXP Semiconductors

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79RC32V334-133BBI Integrated Device Technology Inc

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Rohs Code Yes No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS INTEGRATED DEVICE TECHNOLOGY INC
Package Description 12 X 12 MM, ROHS COMPLIANT, MAPBGA-256 27 X 27 MM, PLASTIC, BGA-256
Reach Compliance Code compliant not_compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Factory Lead Time 13 Weeks
Address Bus Width 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 100 MHz 66.67 MHz
External Data Bus Width 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 256 256
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 260 225
Qualification Status Not Qualified Not Qualified
Speed 250 MHz 133 MHz
Supply Voltage-Max 1.32 V 3.465 V
Supply Voltage-Min 1.14 V 3.135 V
Supply Voltage-Nom 1.2 V 3.3 V
Surface Mount YES YES
Technology CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 20
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR, RISC
Base Number Matches 2 1
Part Package Code BGA
Pin Count 256
JESD-609 Code e0
Length 17 mm
Power Supplies 3.3 V
Seated Height-Max 3.5 mm
Supply Current-Max 630 mA
Terminal Finish Tin/Lead (Sn63Pb37)
Width 17 mm

Compare MCF54416CMJ250 with alternatives

Compare 79RC32V334-133BBI with alternatives