MCF5328CVM240J
vs
MPC604ARS25
feature comparison
| Pbfree Code |
No
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
MOTOROLA INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
LBGA,
|
BGA,
|
| Pin Count |
256
|
256
|
| Reach Compliance Code |
unknown
|
unknown
|
| Address Bus Width |
24
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
80 MHz
|
25 MHz
|
| External Data Bus Width |
32
|
64
|
| Format |
FIXED POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
NO
|
| JESD-30 Code |
S-PBGA-B256
|
S-CBGA-B256
|
| JESD-609 Code |
e0
|
|
| Length |
17 mm
|
21 mm
|
| Low Power Mode |
YES
|
YES
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
256
|
256
|
| Operating Temperature-Max |
85 °C
|
105 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
LBGA
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
220
|
|
| Qualification Status |
COMMERCIAL
|
Not Qualified
|
| Seated Height-Max |
1.6 mm
|
3.16 mm
|
| Speed |
240 MHz
|
25 MHz
|
| Supply Voltage-Max |
1.6 V
|
3.465 V
|
| Supply Voltage-Min |
1.4 V
|
3.135 V
|
| Supply Voltage-Nom |
1.5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
OTHER
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
17 mm
|
21 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
2
|
2
|
| HTS Code |
|
8542.31.00.01
|
| Additional Feature |
|
TWO 128 ENTRY TLB; TEMP SPECIFIED AS JUNCTION TEMP
|
| Number of DMA Channels |
|
|
| Number of External Interrupts |
|
3
|
| Number of Serial I/Os |
|
|
| On Chip Data RAM Width |
|
|
| RAM (words) |
|
0
|
| Technology |
|
CMOS
|
|
|
|
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