MCF5327CVM240
vs
GD80960JC66ET
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
INTEL CORP
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
15 X 15 MM, ROHS COMPLIANT, MAPBGA-196
|
BGA, BGA196,14X14,40
|
| Pin Count |
196
|
196
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
5A992
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
24
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
80 MHz
|
33.3 MHz
|
| External Data Bus Width |
32
|
32
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B196
|
S-PBGA-B196
|
| Length |
15 mm
|
|
| Low Power Mode |
YES
|
YES
|
| Moisture Sensitivity Level |
3
|
1
|
| Number of Terminals |
196
|
196
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA196,14X14,40
|
BGA196,14X14,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
|
| Speed |
240 MHz
|
66 MHz
|
| Supply Voltage-Max |
1.6 V
|
3.45 V
|
| Supply Voltage-Min |
1.4 V
|
3.15 V
|
| Supply Voltage-Nom |
1.5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
TIN SILVER COPPER OVER NICKEL
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
15 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
2
|
2
|
| Supply Current-Max |
|
360 mA
|
|
|
|
Compare MCF5327CVM240 with alternatives
Compare GD80960JC66ET with alternatives