MCF53017CMJ240
vs
MC9328MX1VM20R2
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
NXP SEMICONDUCTORS
|
Part Package Code |
BGA
|
|
Package Description |
MAPBGA-256
|
|
Pin Count |
256
|
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.31.00.01
|
|
Bit Size |
32
|
|
Boundary Scan |
YES
|
|
Format |
FIXED POINT
|
|
Integrated Cache |
YES
|
|
JESD-30 Code |
S-PBGA-B256
|
|
Length |
17 mm
|
|
Low Power Mode |
YES
|
|
Moisture Sensitivity Level |
3
|
|
Number of Terminals |
256
|
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
LBGA
|
|
Package Equivalence Code |
BGA256,16X16,40
|
|
Package Shape |
SQUARE
|
|
Package Style |
GRID ARRAY, LOW PROFILE
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.6 mm
|
|
Speed |
240 MHz
|
|
Supply Voltage-Max |
1.32 V
|
|
Supply Voltage-Min |
1.08 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
TIN SILVER COPPER OVER NICKEL
|
|
Terminal Form |
BALL
|
|
Terminal Pitch |
1 mm
|
|
Terminal Position |
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
17 mm
|
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
|
Base Number Matches |
2
|
4
|
|
|
|
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