MCF53010CQT240
vs
MCF53010CQT240
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
QFP
|
|
| Package Description |
LQFP-208
|
28 X 28 MM, ROHS COMPLIANT, LQFP-208
|
| Pin Count |
208
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
5A992
|
5A992
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Bit Size |
32
|
|
| Boundary Scan |
YES
|
YES
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PQFP-G208
|
S-PQFP-G208
|
| JESD-609 Code |
e3
|
|
| Length |
28 mm
|
|
| Low Power Mode |
YES
|
YES
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
208
|
208
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFQFP
|
QFP
|
| Package Equivalence Code |
QFP208,1.2SQ,20
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.6 mm
|
|
| Speed |
240 MHz
|
240 MHz
|
| Supply Voltage-Max |
1.32 V
|
1.32 V
|
| Supply Voltage-Min |
1.08 V
|
1.08 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
28 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
| Base Number Matches |
1
|
1
|
| Factory Lead Time |
|
4 Weeks
|
| Address Bus Width |
|
24
|
| Clock Frequency-Max |
|
48 MHz
|
| External Data Bus Width |
|
32
|
|
|
|
Compare MCF53010CQT240 with alternatives
Compare MCF53010CQT240 with alternatives