MCF5274VM166 vs IBM25PPC750CXEJQ5012T feature comparison

MCF5274VM166 NXP Semiconductors

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IBM25PPC750CXEJQ5012T IBM

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Rohs Code Yes Yes
Part Life Cycle Code Not Recommended Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS IBM MICROELECTRONICS
Package Description ROHS COMPLIANT, PLASTIC, MAPBGA-256 LBGA, BGA256,20X20,50
Reach Compliance Code compliant unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 13 Weeks
Additional Feature ALSO REQUIRES 3.3V SUPPLY
Address Bus Width 24 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 83 MHz 133 MHz
External Data Bus Width 32 64
Format FIXED POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e1
Length 17 mm 27 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3
Number of Terminals 256 256
Operating Temperature-Max 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.666 mm
Speed 166 MHz 500 MHz
Supply Voltage-Max 1.6 V 1.9 V
Supply Voltage-Min 1.4 V 1.7 V
Supply Voltage-Nom 1.5 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 NOT SPECIFIED
Width 17 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Part Package Code BGA
Pin Count 256
Package Equivalence Code BGA256,20X20,50

Compare MCF5274VM166 with alternatives

Compare IBM25PPC750CXEJQ5012T with alternatives