MCF5274LVM166
vs
MCF5232CVM150
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Not Recommended
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
NXP SEMICONDUCTORS
Part Package Code
BGA
Package Description
ROHS COMPLIANT, MAPBGA-196
ROHS COMPLIANT, MAPBGA-196
Pin Count
196
Reach Compliance Code
compliant
compliant
ECCN Code
5A992
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
LOW POWER MODE TAKEN FROM LOW POWER MODE
Address Bus Width
24
24
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
83 MHz
75 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B196
S-PBGA-B196
Length
15 mm
15 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
3
Number of Terminals
196
196
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA196,14X14,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
1.6 mm
Speed
166 MHz
150 MHz
Supply Voltage-Max
1.6 V
1.6 V
Supply Voltage-Min
1.4 V
1.4 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER OVER NICKEL
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
40
Width
15 mm
15 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
3
4
Factory Lead Time
13 Weeks
Samacsys Manufacturer
NXP
JESD-609 Code
e1
Compare MCF5274LVM166 with alternatives
Compare MCF5232CVM150 with alternatives