MCF5272VF66R2
vs
GD80960JS-33
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
INTEL CORP
Package Description
PLASTIC, BGA-196
BGA, BGA196(UNSPEC)
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Samacsys Manufacturer
NXP
Address Bus Width
23
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
66 MHz
33.3 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B196
S-PBGA-B196
JESD-609 Code
e0
Length
15 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
1
Number of Terminals
196
196
Operating Temperature-Max
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
220
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
Speed
66 MHz
33 MHz
Supply Voltage-Max
3.6 V
3.45 V
Supply Voltage-Min
3 V
3.15 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
15 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
4
1
Part Package Code
BGA
Pin Count
196
Additional Feature
OPERATING CASE TEMPERATURE 0 TO 100 C
Package Equivalence Code
BGA196(UNSPEC)
Supply Current-Max
250 mA
Compare MCF5272VF66R2 with alternatives
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