MCF5251EVM140
vs
MC9328MXLVP20
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
MOTOROLA INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
LEAD FREE, MAPBGA-225
|
LFBGA, BGA225,15X15,32
|
| Pin Count |
225
|
225
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
24
|
25
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
140 MHz
|
16 MHz
|
| External Data Bus Width |
32
|
32
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B225
|
S-PBGA-B225
|
| Length |
13 mm
|
13 mm
|
| Low Power Mode |
NO
|
YES
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
225
|
225
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFBGA
|
LFBGA
|
| Package Equivalence Code |
BGA225,15X15,32
|
BGA225,15X15,32
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.6 mm
|
1.6 mm
|
| Speed |
140 MHz
|
200 MHz
|
| Supply Voltage-Max |
1.32 V
|
2 V
|
| Supply Voltage-Min |
1.08 V
|
1.8 V
|
| Supply Voltage-Nom |
1.2 V
|
1.9 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN SILVER COPPER OVER NICKEL
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
13 mm
|
13 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
4
|
|
|
|
Compare MCF5251EVM140 with alternatives
Compare MC9328MXLVP20 with alternatives