MCF5235CVM150 vs 79RC32T336-150BCGI feature comparison

MCF5235CVM150 Motorola Mobility LLC

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79RC32T336-150BCGI Integrated Device Technology Inc

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MOTOROLA INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA BGA
Package Description LBGA, LBGA, BGA256,16X16,40
Pin Count 256 256
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 24 22
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 75 MHz 75 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
Length 17 mm 17 mm
Low Power Mode YES YES
Number of Terminals 256 256
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.7 mm
Speed 150 MHz 150 MHz
Supply Voltage-Max 1.65 V 2.625 V
Supply Voltage-Min 1.35 V 2.375 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 17 mm 17 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 4 1
Rohs Code Yes
Additional Feature ALSO REQUIRES 3.3V SUPPLY
JESD-609 Code e1
Moisture Sensitivity Level 3
Package Equivalence Code BGA256,16X16,40
Peak Reflow Temperature (Cel) 260
Supply Current-Max 750 mA
Supply Voltage-Nom 2.5 V
Terminal Finish TIN SILVER COPPER
Time@Peak Reflow Temperature-Max (s) 30

Compare MCF5235CVM150 with alternatives

Compare 79RC32T336-150BCGI with alternatives