MCF5235CVM150
vs
MCF54450CVM180
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MOTOROLA INC
|
FREESCALE SEMICONDUCTOR INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
LBGA,
|
17 X 17 MM, ROHS COMPLIANT, MAPBGA-256
|
Pin Count |
256
|
256
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
24
|
32
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
75 MHz
|
60 MHz
|
External Data Bus Width |
32
|
32
|
Format |
FIXED POINT
|
FIXED POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
Length |
17 mm
|
17 mm
|
Low Power Mode |
YES
|
YES
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.6 mm
|
1.6 mm
|
Speed |
150 MHz
|
180 MHz
|
Supply Voltage-Max |
1.65 V
|
1.65 V
|
Supply Voltage-Min |
1.35 V
|
1.35 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
17 mm
|
17 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Samacsys Manufacturer |
|
NXP
|
Moisture Sensitivity Level |
|
3
|
Package Equivalence Code |
|
BGA256,16X16,40
|
Peak Reflow Temperature (Cel) |
|
260
|
Supply Voltage-Nom |
|
1.5 V
|
Terminal Finish |
|
TIN SILVER COPPER OVER NICKEL
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare MCF5235CVM150 with alternatives
Compare MCF54450CVM180 with alternatives