MCF5234CVM150
vs
79RC32T336-150BCGI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Not Recommended
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
ROHS COMPLIANT, MAPBGA-256
LBGA, BGA256,16X16,40
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Factory Lead Time
13 Weeks
Samacsys Manufacturer
NXP
Additional Feature
LOW POWER MODE TAKEN FROM LOW POWER MODE
ALSO REQUIRES 3.3V SUPPLY
Address Bus Width
24
22
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
75 MHz
75 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
Length
17 mm
17 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
3
Number of Terminals
256
256
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
1.7 mm
Speed
150 MHz
150 MHz
Supply Voltage-Max
1.6 V
2.625 V
Supply Voltage-Min
1.4 V
2.375 V
Supply Voltage-Nom
1.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
30
Width
17 mm
17 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
2
Part Package Code
BGA
Pin Count
256
JESD-609 Code
e1
Package Equivalence Code
BGA256,16X16,40
Supply Current-Max
750 mA
Terminal Finish
TIN SILVER COPPER
Compare MCF5234CVM150 with alternatives
Compare 79RC32T336-150BCGI with alternatives