MCF5232CVM100
vs
MCF5275LCVM166
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MOTOROLA INC
|
MOTOROLA INC
|
| Package Description |
MAPBGA-196
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
24
|
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
|
| Clock Frequency-Max |
75 MHz
|
|
| External Data Bus Width |
32
|
|
| Format |
FIXED POINT
|
|
| Integrated Cache |
YES
|
|
| JESD-30 Code |
S-PBGA-B196
|
S-PBGA-B196
|
| Length |
15 mm
|
|
| Low Power Mode |
YES
|
|
| Number of Terminals |
196
|
196
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
|
| Speed |
100 MHz
|
166 MHz
|
| Supply Voltage-Max |
1.65 V
|
|
| Supply Voltage-Min |
1.35 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
15 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
4
|
3
|
| Rohs Code |
|
Yes
|
| Package Equivalence Code |
|
BGA196,14X14,40
|
|
|
|