MCF52277CVM160
vs
GD80960JC-50
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Not Recommended
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
INTEL CORP
Package Description
15 X 15 MM, ROHS COMPLIANT, MAPBGA-196
BGA, BGA196(UNSPEC)
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Factory Lead Time
13 Weeks
Address Bus Width
24
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
66.67 MHz
25 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
NO
JESD-30 Code
S-PBGA-B196
S-PBGA-B196
JESD-609 Code
e1
Length
15 mm
Low Power Mode
NO
YES
Moisture Sensitivity Level
3
1
Number of Terminals
196
196
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
BGA
Package Equivalence Code
BGA196,14X14,40
BGA196(UNSPEC)
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.7 mm
Speed
166.67 MHz
50 MHz
Supply Current-Max
0.7 mA
330 mA
Supply Voltage-Max
1.6 V
3.45 V
Supply Voltage-Min
1.4 V
3.15 V
Supply Voltage-Nom
1.5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
0.5 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Width
15 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
2
1
Part Package Code
BGA
Pin Count
196
Additional Feature
OPERATING CASE TEMPERATURE 0 TO 100 C
Compare MCF52277CVM160 with alternatives
Compare GD80960JC-50 with alternatives