MCF51AC256BVPUE
vs
MCF51AC256AVFUE
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
NXP SEMICONDUCTORS
Part Package Code
QFP
Package Description
10 X 10 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, MS-026BCD, LQFP-64
14 X 14 MM, LEAD FREE, QFP-64
Pin Count
64
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
YES
Bit Size
32
32
CPU Family
COLDFIRE
COLDFIRE
Clock Frequency-Max
16 MHz
16 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
JESD-30 Code
S-PQFP-G64
S-PQFP-G64
JESD-609 Code
e3
e3
Length
10 mm
14 mm
Moisture Sensitivity Level
3
3
Number of I/O Lines
54
54
Number of Terminals
64
64
On Chip Program ROM Width
8
8
Operating Temperature-Max
105 °C
105 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
QFP
Package Equivalence Code
QFP64,.47SQ,20
QFP64,.66SQ,32
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
FLATPACK
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
32768
32768
ROM (words)
262144
262144
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.6 mm
2.45 mm
Speed
50.33 MHz
50.33 MHz
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
2.7 V
5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
Tin (Sn)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.8 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
40
40
Width
10 mm
14 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
1
1
Factory Lead Time
13 Weeks
Samacsys Manufacturer
NXP
Address Bus Width
External Data Bus Width
Compare MCF51AC256BVPUE with alternatives
Compare MCF51AC256AVFUE with alternatives