MC9S12XEP100VAL
vs
MC9S12XEP100MVLR
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
FREESCALE SEMICONDUCTOR INC
Package Description
LQFP-112
MAPBGA-208
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
YES
Additional Feature
IT ALSO REQUIRES 5 V I/O SUPPLY
IT ALSO REQUIRES 5 V I/O SUPPLY
Address Bus Width
23
23
Bit Size
32
32
CPU Family
CPU12
CPU12
Clock Frequency-Max
40 MHz
40 MHz
DAC Channels
NO
NO
DMA Channels
YES
YES
External Data Bus Width
16
16
JESD-30 Code
S-PQFP-G112
S-PBGA-B208
Length
20 mm
17 mm
Number of I/O Lines
91
152
Number of Terminals
112
208
On Chip Program ROM Width
8
8
Operating Temperature-Max
105 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
BGA
Package Equivalence Code
QFP112,.87SQ
BGA208,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
65536
65536
ROM (words)
1048576
1048576
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.6 mm
2 mm
Speed
50 MHz
50 MHz
Supply Voltage-Max
1.98 V
1.98 V
Supply Voltage-Min
1.8 V
1.72 V
Supply Voltage-Nom
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Form
GULL WING
BALL
Terminal Pitch
0.65 mm
1 mm
Terminal Position
QUAD
BOTTOM
Width
20 mm
17 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER, RISC
Base Number Matches
2
2
Rohs Code
Part Package Code
BGA
Pin Count
208
JESD-609 Code
e2
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Terminal Finish
TIN SILVER
Time@Peak Reflow Temperature-Max (s)
40
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Compare MC9S12XEP100MVLR with alternatives