MC9S12XEP100CVLR
vs
MC9S12XEP100CAG
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Package Description |
MAPBGA-208
|
LQFP-144
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
YES
|
| Additional Feature |
IT ALSO REQUIRES 5 V I/O SUPPLY
|
IT ALSO REQUIRES 5 V I/O SUPPLY
|
| Address Bus Width |
23
|
23
|
| Bit Size |
32
|
32
|
| CPU Family |
CPU12
|
CPU12
|
| Clock Frequency-Max |
40 MHz
|
40 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
YES
|
NO
|
| External Data Bus Width |
16
|
16
|
| JESD-30 Code |
S-PBGA-B208
|
S-PQFP-G144
|
| Length |
17 mm
|
20 mm
|
| Number of I/O Lines |
152
|
119
|
| Number of Terminals |
208
|
144
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
LFQFP
|
| Package Equivalence Code |
BGA208,16X16,40
|
QFP144,.87SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
65536
|
65536
|
| ROM (words) |
1048576
|
1048576
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
2 mm
|
1.6 mm
|
| Speed |
50 MHz
|
50 MHz
|
| Supply Voltage-Max |
1.98 V
|
1.98 V
|
| Supply Voltage-Min |
1.8 V
|
1.72 V
|
| Supply Voltage-Nom |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
1 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Width |
17 mm
|
20 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
2
|
| Factory Lead Time |
|
17 Weeks
|
| Samacsys Manufacturer |
|
NXP
|
| Boundary Scan |
|
NO
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Terminal Finish |
|
Tin (Sn)
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare MC9S12XEP100CVLR with alternatives
Compare MC9S12XEP100CAG with alternatives