MC9S12XEP100CVL vs MC9S12XEP100MALR feature comparison

MC9S12XEP100CVL Freescale Semiconductor

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MC9S12XEP100MALR NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC NXP SEMICONDUCTORS
Part Package Code BGA
Package Description MAPBGA-208 LQFP-112
Pin Count 208
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP
Has ADC YES YES
Additional Feature IT ALSO REQUIRES 5 V I/O SUPPLY IT ALSO REQUIRES 5 V I/O SUPPLY
Address Bus Width 23 23
Bit Size 32 32
CPU Family CPU12 CPU12
Clock Frequency-Max 40 MHz 40 MHz
DAC Channels NO NO
DMA Channels YES YES
External Data Bus Width 16 16
JESD-30 Code S-PBGA-B208 S-PQFP-G112
JESD-609 Code e2
Length 17 mm 20 mm
Moisture Sensitivity Level 3
Number of I/O Lines 152 91
Number of Terminals 208 112
On Chip Program ROM Width 8 8
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LQFP
Package Equivalence Code BGA208,16X16,40 QFP112,.87SQ
Package Shape SQUARE SQUARE
Package Style GRID ARRAY FLATPACK, LOW PROFILE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
RAM (bytes) 65536 65536
ROM (words) 1048576 1048576
ROM Programmability FLASH FLASH
Seated Height-Max 2 mm 1.6 mm
Speed 50 MHz 50 MHz
Supply Voltage-Max 1.98 V 1.98 V
Supply Voltage-Min 1.72 V 1.72 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish TIN SILVER
Terminal Form BALL GULL WING
Terminal Pitch 1 mm 0.65 mm
Terminal Position BOTTOM QUAD
Time@Peak Reflow Temperature-Max (s) 40
Width 17 mm 20 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 2 2

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