MC9S12XDT512MALR
vs
MC9S12XDT512VALR
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
NXP SEMICONDUCTORS
Part Package Code
QFP
Package Description
LEAD FREE, LQFP-112
Pin Count
112
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
Additional Feature
IT ALSO REQUIRES 5 V SUPPLY
Address Bus Width
Bit Size
16
CPU Family
CPU12
Clock Frequency-Max
80 MHz
DAC Channels
NO
DMA Channels
YES
External Data Bus Width
JESD-30 Code
S-PQFP-G112
JESD-609 Code
e3
Length
20 mm
Moisture Sensitivity Level
3
Number of I/O Lines
91
Number of Terminals
112
On Chip Program ROM Width
8
Operating Temperature-Max
125 °C
Operating Temperature-Min
-40 °C
PWM Channels
YES
Package Body Material
PLASTIC/EPOXY
Package Code
LQFP
Package Equivalence Code
QFP112,.87SQ
Package Shape
SQUARE
Package Style
FLATPACK, LOW PROFILE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
RAM (bytes)
20480
ROM (words)
524288
ROM Programmability
FLASH
Seated Height-Max
1.6 mm
Speed
40 MHz
Supply Voltage-Max
2.75 V
Supply Voltage-Min
2.35 V
Supply Voltage-Nom
2.5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
AUTOMOTIVE
Terminal Finish
MATTE TIN
Terminal Form
GULL WING
Terminal Pitch
0.65 mm
Terminal Position
QUAD
Time@Peak Reflow Temperature-Max (s)
40
Width
20 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
Base Number Matches
2
2
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