MC9S12XDT256VFUR
vs
MC9S12XDT256MFUR
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
FREESCALE SEMICONDUCTOR INC
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Base Number Matches
2
2
Part Package Code
QFP
Package Description
PLASTIC, QFP-80
Pin Count
80
ECCN Code
3A991.A.2
Has ADC
YES
Additional Feature
IT ALSO REQUIRES 5 V SUPPLY
Address Bus Width
Bit Size
16
Boundary Scan
NO
CPU Family
CPU12
Clock Frequency-Max
80 MHz
DAC Channels
NO
DMA Channels
YES
External Data Bus Width
JESD-30 Code
S-PQFP-G80
Length
14 mm
Moisture Sensitivity Level
1
Number of I/O Lines
59
Number of Terminals
80
On Chip Program ROM Width
8
Operating Temperature-Max
125 °C
Operating Temperature-Min
-40 °C
PWM Channels
YES
Package Body Material
PLASTIC/EPOXY
Package Code
QFP
Package Equivalence Code
QFP80,.68SQ
Package Shape
SQUARE
Package Style
FLATPACK
Qualification Status
Not Qualified
RAM (bytes)
16384
ROM (words)
262144
ROM Programmability
FLASH
Seated Height-Max
2.45 mm
Speed
40 MHz
Supply Voltage-Max
2.75 V
Supply Voltage-Min
2.35 V
Supply Voltage-Nom
2.5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
AUTOMOTIVE
Terminal Form
GULL WING
Terminal Pitch
0.65 mm
Terminal Position
QUAD
Width
14 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
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