MC9S12XDT256CAA
vs
MC9S12XA512VAL
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Package Description |
LEAD FREE, PLASTIC, QFP-80
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
|
| Factory Lead Time |
4 Weeks
|
4 Weeks
|
| Samacsys Manufacturer |
NXP
|
|
| Has ADC |
YES
|
|
| Additional Feature |
IT ALSO REQUIRES 5 V SUPPLY
|
|
| Address Bus Width |
|
|
| Bit Size |
16
|
|
| Boundary Scan |
NO
|
|
| CPU Family |
CPU12
|
|
| Clock Frequency-Max |
80 MHz
|
|
| DAC Channels |
NO
|
|
| DMA Channels |
YES
|
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PQFP-G80
|
|
| JESD-609 Code |
e3
|
|
| Length |
14 mm
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of I/O Lines |
59
|
|
| Number of Terminals |
80
|
|
| On Chip Program ROM Width |
8
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| PWM Channels |
YES
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
QFP
|
|
| Package Equivalence Code |
QFP80,.68SQ
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
FLATPACK
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
|
| RAM (bytes) |
4096
|
|
| ROM (words) |
262144
|
|
| ROM Programmability |
FLASH
|
|
| Seated Height-Max |
2.45 mm
|
|
| Speed |
40 MHz
|
|
| Supply Voltage-Max |
2.75 V
|
|
| Supply Voltage-Min |
2.5 V
|
|
| Supply Voltage-Nom |
2.5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
Tin (Sn)
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
QUAD
|
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
14 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare MC9S12XDT256CAA with alternatives
Compare MC9S12XA512VAL with alternatives