MC9S12XDP512MALR
vs
MC9S12XD128CFVR
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
LEAD FREE, LQFP-112
LQFP-144
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Date Of Intro
2016-03-07
Has ADC
YES
YES
Additional Feature
IT ALSO REQUIRES 5 V SUPPLY
IT ALSO REQUIRES 5 V SUPPLY
Address Bus Width
Bit Size
16
16
Boundary Scan
YES
NO
Clock Frequency-Max
80 MHz
80 MHz
DAC Channels
NO
NO
DMA Channels
YES
YES
External Data Bus Width
JESD-30 Code
S-PQFP-G112
S-PQFP-G144
Length
20 mm
20 mm
Number of I/O Lines
91
119
Number of Terminals
112
144
On Chip Program ROM Width
8
8
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
LFQFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE
FLATPACK, LOW PROFILE, FINE PITCH
ROM (words)
524288
131072
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.6 mm
1.6 mm
Speed
40 MHz
40 MHz
Supply Voltage-Max
2.75 V
2.75 V
Supply Voltage-Min
2.35 V
2.35 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.5 mm
Terminal Position
QUAD
QUAD
Width
20 mm
20 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER
Base Number Matches
1
1
Qualification Status
Not Qualified
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