MC9S12XA256CAG
vs
MC9S12XB256MFUR
feature comparison
All Stats
Differences Only
Pbfree Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
NXP SEMICONDUCTORS
Part Package Code
QFP
Package Description
LEAD FREE, LQFP-144
Pin Count
144
Reach Compliance Code
unknown
unknown
Has ADC
YES
YES
Address Bus Width
Bit Size
16
16
Clock Frequency-Max
80 MHz
80 MHz
DAC Channels
NO
NO
DMA Channels
YES
YES
External Data Bus Width
JESD-30 Code
S-PQFP-G144
S-PQFP-G80
JESD-609 Code
e3
Length
20 mm
14 mm
Moisture Sensitivity Level
3
1
Number of I/O Lines
119
59
Number of Terminals
144
80
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
QFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
FLATPACK
Peak Reflow Temperature (Cel)
260
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.6 mm
2.45 mm
Speed
40 MHz
40 MHz
Supply Voltage-Max
2.75 V
2.75 V
Supply Voltage-Min
2.35 V
2.35 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.65 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
40
Width
20 mm
14 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
3
2
Rohs Code
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Additional Feature
IT ALSO REQUIRES 5 V SUPPLY
CPU Family
CPU12
On Chip Program ROM Width
8
Package Equivalence Code
QFP80,.68SQ
Qualification Status
Not Qualified
RAM (bytes)
10240
ROM (words)
262144
Compare MC9S12XA256CAG with alternatives
Compare MC9S12XB256MFUR with alternatives