MC9S12DT256CVPV
vs
MC9S12DT128EMFU
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
MOTOROLA INC
|
| Part Package Code |
QFP
|
|
| Package Description |
LQFP-112
|
QFP,
|
| Pin Count |
112
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
19
|
16
|
| Bit Size |
16
|
16
|
| Clock Frequency-Max |
16 MHz
|
16 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
16
|
16
|
| JESD-30 Code |
S-PQFP-G112
|
S-PQFP-G80
|
| Length |
20 mm
|
14 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of I/O Lines |
91
|
59
|
| Number of Terminals |
112
|
80
|
| Operating Temperature-Max |
105 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
NO
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LQFP
|
QFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE
|
FLATPACK
|
| Peak Reflow Temperature (Cel) |
225
|
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
1.6 mm
|
2.45 mm
|
| Speed |
25 MHz
|
25 MHz
|
| Supply Voltage-Max |
2.75 V
|
2.75 V
|
| Supply Voltage-Min |
2.35 V
|
2.35 V
|
| Supply Voltage-Nom |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
20 mm
|
14 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
4
|
2
|
| HTS Code |
|
8542.31.00.01
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare MC9S12DT256CVPV with alternatives
Compare MC9S12DT128EMFU with alternatives