MC9S12DT256CPV
vs
MC9S12DJ64CPV
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MOTOROLA INC
NXP SEMICONDUCTORS
Package Description
LQFP-112
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
Has ADC
YES
Address Bus Width
16
Bit Size
16
CPU Family
CPU12
Clock Frequency-Max
16 MHz
DAC Channels
NO
DMA Channels
NO
External Data Bus Width
16
JESD-30 Code
S-PQFP-G112
Length
20 mm
Number of I/O Lines
91
Number of Terminals
112
On Chip Program ROM Width
8
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
PWM Channels
YES
Package Body Material
PLASTIC/EPOXY
Package Code
LQFP
Package Equivalence Code
QFP112,.87SQ
Package Shape
SQUARE
Package Style
FLATPACK, LOW PROFILE
Qualification Status
Not Qualified
RAM (bytes)
12288
ROM (words)
262144
ROM Programmability
FLASH
Seated Height-Max
1.6 mm
Speed
25 MHz
Supply Voltage-Max
2.75 V
Supply Voltage-Min
2.35 V
Supply Voltage-Nom
2.5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
GULL WING
Terminal Pitch
0.65 mm
Terminal Position
QUAD
Width
20 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
Base Number Matches
3
5
Factory Lead Time
4 Weeks
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