MC9S12DT128EMFU vs MC9S12D64MPV feature comparison

MC9S12DT128EMFU Motorola Mobility LLC

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MC9S12D64MPV NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Part Package Code QFP
Package Description QFP,
Pin Count 80
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01
Has ADC YES
Address Bus Width 16
Bit Size 16
Clock Frequency-Max 16 MHz
DAC Channels NO
DMA Channels NO
External Data Bus Width 16
JESD-30 Code S-PQFP-G80
Length 14 mm
Number of I/O Lines 59
Number of Terminals 80
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
PWM Channels NO
Package Body Material PLASTIC/EPOXY
Package Code QFP
Package Shape SQUARE
Package Style FLATPACK
Qualification Status Not Qualified
ROM Programmability FLASH
Seated Height-Max 2.45 mm
Speed 25 MHz
Supply Voltage-Max 2.75 V
Supply Voltage-Min 2.35 V
Supply Voltage-Nom 2.5 V
Surface Mount YES
Technology CMOS
Temperature Grade AUTOMOTIVE
Terminal Form GULL WING
Terminal Pitch 0.65 mm
Terminal Position QUAD
Width 14 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Base Number Matches 2 4

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Compare MC9S12D64MPV with alternatives