MC9S12DJ64MPVE
vs
MC9S12DG128VFU
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
MOTOROLA INC
|
Part Package Code |
QFP
|
QFP
|
Package Description |
LQFP-112
|
QFP, QFP80,.68SQ
|
Pin Count |
112
|
80
|
Reach Compliance Code |
unknown
|
unknown
|
Has ADC |
YES
|
YES
|
Address Bus Width |
16
|
16
|
Bit Size |
16
|
16
|
Clock Frequency-Max |
16 MHz
|
16 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
16
|
16
|
JESD-30 Code |
S-PQFP-G112
|
S-PQFP-G80
|
JESD-609 Code |
e3
|
|
Length |
20 mm
|
14 mm
|
Moisture Sensitivity Level |
3
|
|
Number of I/O Lines |
91
|
59
|
Number of Terminals |
112
|
80
|
Operating Temperature-Max |
125 °C
|
105 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LQFP
|
QFP
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, LOW PROFILE
|
FLATPACK
|
Peak Reflow Temperature (Cel) |
260
|
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
1.6 mm
|
2.45 mm
|
Speed |
25 MHz
|
25 MHz
|
Supply Voltage-Max |
2.75 V
|
2.75 V
|
Supply Voltage-Min |
2.35 V
|
2.35 V
|
Supply Voltage-Nom |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
Terminal Finish |
TIN
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
20 mm
|
14 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
1
|
1
|
HTS Code |
|
8542.31.00.01
|
Additional Feature |
|
ALSO REQUIRES 5V SUPPLY
|
CPU Family |
|
CPU12
|
On Chip Program ROM Width |
|
8
|
Package Equivalence Code |
|
QFP80,.68SQ
|
Qualification Status |
|
Not Qualified
|
RAM (bytes) |
|
8192
|
ROM (words) |
|
65536
|
|
|
|
Compare MC9S12DJ64MPVE with alternatives
Compare MC9S12DG128VFU with alternatives