MC9S12DJ64CPV
vs
MC9S12DG128VFUE
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
FREESCALE SEMICONDUCTOR INC
Reach Compliance Code
unknown
compliant
Factory Lead Time
4 Weeks
Base Number Matches
5
2
Pbfree Code
Rohs Code
Part Package Code
QFP
Package Description
PLASTIC, LQFP-80
Pin Count
80
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Has ADC
YES
Additional Feature
ALSO REQUIRES 5V SUPPLY
Address Bus Width
16
Bit Size
16
Clock Frequency-Max
50 MHz
DAC Channels
NO
DMA Channels
NO
External Data Bus Width
16
JESD-30 Code
S-PQFP-G80
JESD-609 Code
e3
Length
14 mm
Moisture Sensitivity Level
3
Number of I/O Lines
59
Number of Terminals
80
Operating Temperature-Max
105 °C
Operating Temperature-Min
-40 °C
PWM Channels
YES
Package Body Material
PLASTIC/EPOXY
Package Code
QFP
Package Shape
SQUARE
Package Style
FLATPACK
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
ROM Programmability
FLASH
Seated Height-Max
2.45 mm
Speed
25 MHz
Supply Voltage-Max
2.75 V
Supply Voltage-Min
2.35 V
Supply Voltage-Nom
2.5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
MATTE TIN
Terminal Form
GULL WING
Terminal Pitch
0.65 mm
Terminal Position
QUAD
Time@Peak Reflow Temperature-Max (s)
40
Width
14 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
Compare MC9S12DJ64CPV with alternatives
Compare MC9S12DG128VFUE with alternatives