MC9S12DJ256MPVE vs MC9S12DJ256CFUE feature comparison

MC9S12DJ256MPVE Rochester Electronics LLC

Buy Now Datasheet

MC9S12DJ256CFUE NXP Semiconductors

Buy Now Datasheet
Pbfree Code Yes
Part Life Cycle Code Active Active
Ihs Manufacturer ROCHESTER ELECTRONICS LLC NXP SEMICONDUCTORS
Part Package Code QFP
Package Description LQFP-112 QFP-80
Pin Count 112
Reach Compliance Code unknown compliant
Has ADC YES YES
Address Bus Width 19 16
Bit Size 16 16
Clock Frequency-Max 16 MHz 16 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 16 16
JESD-30 Code S-PQFP-G112 S-PQFP-G80
JESD-609 Code e3 e3
Length 20 mm 14 mm
Moisture Sensitivity Level 3 3
Number of I/O Lines 91 59
Number of Terminals 112 80
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP QFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE FLATPACK
Peak Reflow Temperature (Cel) 260 260
ROM Programmability FLASH FLASH
Seated Height-Max 1.6 mm 2.45 mm
Speed 25 MHz 25 MHz
Supply Voltage-Max 2.75 V 2.75 V
Supply Voltage-Min 2.35 V 2.5 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish MATTE TIN Matte Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 40 40
Width 20 mm 14 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 3 2
Rohs Code Yes
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Factory Lead Time 13 Weeks
Samacsys Manufacturer NXP
Additional Feature ALSO REQUIRES 5V SUPPLY
Boundary Scan NO
CPU Family CPU12
On Chip Program ROM Width 8
Package Equivalence Code QFP80,.68SQ
Qualification Status Not Qualified
RAM (bytes) 12288
ROM (words) 262144
Supply Current-Max 65 mA

Compare MC9S12DJ256MPVE with alternatives

Compare MC9S12DJ256CFUE with alternatives