MC9S12DJ128CPVE
vs
MC9S12DJ128MPVE
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
LEAD FREE, LQFP-112
LEAD FREE, LQFP-112
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Factory Lead Time
13 Weeks
13 Weeks
Samacsys Manufacturer
NXP
Has ADC
YES
YES
Additional Feature
ALSO REQUIRES 5V SUPPLY
ALSO REQUIRES 5V SUPPLY
Address Bus Width
20
20
Bit Size
16
16
Boundary Scan
NO
NO
Clock Frequency-Max
50 MHz
50 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
16
16
JESD-30 Code
S-PQFP-G112
S-PQFP-G112
JESD-609 Code
e3
e3
Length
20 mm
20 mm
Moisture Sensitivity Level
3
3
Number of I/O Lines
91
91
Number of Terminals
112
112
On Chip Program ROM Width
8
8
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
LQFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE
FLATPACK, LOW PROFILE
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
ROM (words)
131072
131072
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.6 mm
1.6 mm
Speed
25 MHz
25 MHz
Supply Voltage-Max
2.75 V
2.75 V
Supply Voltage-Min
2.35 V
2.35 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
Matte Tin (Sn)
Matte Tin (Sn)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
40
40
Width
20 mm
20 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
1
1
Compare MC9S12DJ128CPVE with alternatives
Compare MC9S12DJ128MPVE with alternatives