MC9S12DG256CCPV vs MC9S12DG256BMPV feature comparison

MC9S12DG256CCPV Freescale Semiconductor

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MC9S12DG256BMPV Motorola Semiconductor Products

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC MOTOROLA INC
Part Package Code QFP
Package Description LQFP-112 LQFP-112
Pin Count 112
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC YES YES
Additional Feature ALSO REQUIRES 5V SUPPLY ALSO REQUIRES 5V SUPPLY
Address Bus Width 19 16
Bit Size 16 16
Boundary Scan NO
CPU Family CPU12 CPU12
Clock Frequency-Max 16 MHz 16 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 16 16
JESD-30 Code S-PQFP-G112 S-PQFP-G112
JESD-609 Code e0
Length 20 mm 20 mm
Moisture Sensitivity Level 3
Number of I/O Lines 91 91
Number of Terminals 112 112
On Chip Program ROM Width 8 8
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP LQFP
Package Equivalence Code QFP112,.87SQ QFP112,.87SQ
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Peak Reflow Temperature (Cel) 220
Qualification Status Not Qualified Not Qualified
RAM (bytes) 12288 12288
ROM (words) 262144 262144
ROM Programmability FLASH FLASH
Seated Height-Max 1.6 mm 1.6 mm
Speed 25 MHz 25 MHz
Supply Current-Max 65 mA 65 mA
Supply Voltage-Max 2.75 V 2.75 V
Supply Voltage-Min 2.5 V 2.35 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 20 mm 20 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 4 3

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