MC9S12DG128BMFU vs MC9S12DG128MFUR2 feature comparison

MC9S12DG128BMFU Motorola Mobility LLC

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MC9S12DG128MFUR2 Freescale Semiconductor

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MOTOROLA INC FREESCALE SEMICONDUCTOR INC
Part Package Code QFP QFP
Package Description QFP, QFP,
Pin Count 80 80
Reach Compliance Code unknown compliant
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC YES YES
Additional Feature ALSO REQUIRES 5V SUPPLY ALSO REQUIRES 5V SUPPLY
Address Bus Width 16 16
Bit Size 16 16
Clock Frequency-Max 16 MHz 50 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 16 16
JESD-30 Code S-PQFP-G80 S-PQFP-G80
Length 14 mm 14 mm
Number of I/O Lines 59 59
Number of Terminals 80 80
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP QFP
Package Shape SQUARE SQUARE
Package Style FLATPACK FLATPACK
Qualification Status Not Qualified Not Qualified
ROM Programmability FLASH FLASH
Seated Height-Max 2.45 mm 2.45 mm
Speed 25 MHz 25 MHz
Supply Voltage-Max 2.75 V 2.75 V
Supply Voltage-Min 2.35 V 2.35 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position QUAD QUAD
Width 14 mm 14 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 4 1
Rohs Code Yes
ECCN Code EAR99
Boundary Scan NO
JESD-609 Code e0
Moisture Sensitivity Level 3
On Chip Program ROM Width 8
Peak Reflow Temperature (Cel) 220
ROM (words) 131072
Terminal Finish Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s) 30

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Compare MC9S12DG128MFUR2 with alternatives