MC9S12DG128BMFU
vs
MC9S12DG128MFUR2
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MOTOROLA INC
FREESCALE SEMICONDUCTOR INC
Part Package Code
QFP
QFP
Package Description
QFP,
QFP,
Pin Count
80
80
Reach Compliance Code
unknown
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
YES
Additional Feature
ALSO REQUIRES 5V SUPPLY
ALSO REQUIRES 5V SUPPLY
Address Bus Width
16
16
Bit Size
16
16
Clock Frequency-Max
16 MHz
50 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
16
16
JESD-30 Code
S-PQFP-G80
S-PQFP-G80
Length
14 mm
14 mm
Number of I/O Lines
59
59
Number of Terminals
80
80
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QFP
QFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK
Qualification Status
Not Qualified
Not Qualified
ROM Programmability
FLASH
FLASH
Seated Height-Max
2.45 mm
2.45 mm
Speed
25 MHz
25 MHz
Supply Voltage-Max
2.75 V
2.75 V
Supply Voltage-Min
2.35 V
2.35 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
QUAD
QUAD
Width
14 mm
14 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
4
1
Rohs Code
ECCN Code
EAR99
Boundary Scan
NO
JESD-609 Code
e0
Moisture Sensitivity Level
3
On Chip Program ROM Width
8
Peak Reflow Temperature (Cel)
220
ROM (words)
131072
Terminal Finish
Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s)
30
Compare MC9S12DG128BMFU with alternatives
Compare MC9S12DG128MFUR2 with alternatives