MC9S12C64PCFU25
vs
MC9S12C64VFA25
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
NXP SEMICONDUCTORS
|
Part Package Code |
QFP
|
|
Package Description |
QFP-80
|
LFQFP,
|
Pin Count |
80
|
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
YES
|
YES
|
Additional Feature |
ALSO REQUIRES 5V SUPPLY
|
ALSO REQUIRES 5V SUPPLY
|
Address Bus Width |
16
|
|
Bit Size |
16
|
16
|
Boundary Scan |
NO
|
NO
|
CPU Family |
CPU12
|
|
Clock Frequency-Max |
50 MHz
|
50 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
16
|
|
JESD-30 Code |
S-PQFP-G80
|
S-PQFP-G48
|
Length |
14 mm
|
7 mm
|
Number of I/O Lines |
60
|
31
|
Number of Terminals |
80
|
48
|
On Chip Program ROM Width |
8
|
8
|
Operating Temperature-Max |
85 °C
|
105 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QFP
|
LFQFP
|
Package Equivalence Code |
QFP80,.68SQ
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK
|
FLATPACK, LOW PROFILE, FINE PITCH
|
Qualification Status |
Not Qualified
|
|
RAM (bytes) |
4096
|
|
ROM (words) |
65536
|
65536
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
2.45 mm
|
1.6 mm
|
Speed |
25 MHz
|
25 MHz
|
Supply Voltage-Max |
2.75 V
|
2.75 V
|
Supply Voltage-Min |
2.5 V
|
2.35 V
|
Supply Voltage-Nom |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
14 mm
|
7 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
3
|
4
|
Date Of Intro |
|
2016-04-02
|
|
|
|
Compare MC9S12C64PCFU25 with alternatives
Compare MC9S12C64VFA25 with alternatives