MC9S12C32CPB16
vs
MC9S12C128CFUE25
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MOTOROLA INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
QFP
|
|
| Package Description |
LQFP, QFP52,.47SQ
|
PLASTIC, QFP-80
|
| Pin Count |
52
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
|
16
|
| Bit Size |
16
|
16
|
| CPU Family |
CPU12
|
|
| Clock Frequency-Max |
50 MHz
|
50 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
16
|
| JESD-30 Code |
S-PQFP-G52
|
S-PQFP-G80
|
| Length |
10 mm
|
14 mm
|
| Number of I/O Lines |
35
|
60
|
| Number of Terminals |
52
|
80
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LQFP
|
QFP
|
| Package Equivalence Code |
QFP52,.47SQ
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
4096
|
|
| ROM (words) |
32768
|
131072
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
1.7 mm
|
2.45 mm
|
| Speed |
16 MHz
|
25 MHz
|
| Supply Voltage-Max |
2.75 V
|
2.75 V
|
| Supply Voltage-Min |
2.25 V
|
2.35 V
|
| Supply Voltage-Nom |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
10 mm
|
14 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
4
|
2
|
| Additional Feature |
|
ALSO REQUIRES 5V SUPPLY
|
| Boundary Scan |
|
NO
|
|
|
|
Compare MC9S12C32CPB16 with alternatives
Compare MC9S12C128CFUE25 with alternatives