MC9S12C128VPBE25 vs MC9S12C96CFU16 feature comparison

MC9S12C128VPBE25 NXP Semiconductors

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MC9S12C96CFU16 Motorola Semiconductor Products

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Part Life Cycle Code Active Transferred
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Package Description PLASTIC, LQFP-52 QFP,
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Date Of Intro 2016-04-02
Has ADC YES YES
Additional Feature ALSO REQUIRES 5V SUPPLY
Address Bus Width 16 16
Bit Size 16 16
Boundary Scan NO
Clock Frequency-Max 50 MHz 50 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 16 16
JESD-30 Code S-PQFP-G52 S-PQFP-G80
Length 10 mm 14 mm
Number of I/O Lines 35 60
Number of Terminals 52 80
On Chip Program ROM Width 8
Operating Temperature-Max 105 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP QFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE FLATPACK
ROM (words) 131072
ROM Programmability FLASH FLASH
Seated Height-Max 1.7 mm 2.45 mm
Speed 25 MHz 16 MHz
Supply Voltage-Max 2.75 V 2.75 V
Supply Voltage-Min 2.35 V 2.25 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position QUAD QUAD
Width 10 mm 14 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 2 3
Qualification Status Not Qualified

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