MC9S12C128MPBR2
vs
MC9S12C128MPB
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
NXP SEMICONDUCTORS
Part Package Code
QFP
Package Description
PLASTIC, LQFP-52
LQFP-52
Pin Count
52
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
YES
Additional Feature
ALSO REQUIRES 5V SUPPLY
IT ALSO REQUIRES 5V NOM ANALOG SUPPLY
Address Bus Width
16
Bit Size
16
16
Clock Frequency-Max
50 MHz
50 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
16
JESD-30 Code
S-PQFP-G52
S-PQFP-G52
JESD-609 Code
e0
Length
10 mm
10 mm
Moisture Sensitivity Level
3
Number of I/O Lines
35
35
Number of Terminals
52
52
On Chip Program ROM Width
8
8
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
LQFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE
FLATPACK, LOW PROFILE
Peak Reflow Temperature (Cel)
240
Qualification Status
Not Qualified
ROM (words)
131072
131072
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.7 mm
1.7 mm
Speed
25 MHz
25 MHz
Supply Voltage-Max
2.75 V
2.75 V
Supply Voltage-Min
2.35 V
2.35 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
Width
10 mm
10 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
1
2
Boundary Scan
NO
RAM (bytes)
4096
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