MC9S12C128CFUE25
vs
MC9S12C64PCFA25
feature comparison
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MOTOROLA INC
|
| Package Description |
PLASTIC, QFP-80
|
LFQFP, QFP48,.35SQ,20
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
YES
|
| Additional Feature |
ALSO REQUIRES 5V SUPPLY
|
|
| Address Bus Width |
16
|
|
| Bit Size |
16
|
16
|
| Boundary Scan |
NO
|
|
| Clock Frequency-Max |
50 MHz
|
50 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
16
|
|
| JESD-30 Code |
S-PQFP-G80
|
S-PQFP-G48
|
| Length |
14 mm
|
7 mm
|
| Number of I/O Lines |
60
|
31
|
| Number of Terminals |
80
|
48
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QFP
|
LFQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| ROM (words) |
131072
|
65536
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
2.45 mm
|
1.6 mm
|
| Speed |
25 MHz
|
25 MHz
|
| Supply Voltage-Max |
2.75 V
|
2.75 V
|
| Supply Voltage-Min |
2.35 V
|
2.25 V
|
| Supply Voltage-Nom |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
14 mm
|
7 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
2
|
3
|
| Part Package Code |
|
QFP
|
| Pin Count |
|
48
|
| CPU Family |
|
CPU12
|
| Package Equivalence Code |
|
QFP48,.35SQ,20
|
| RAM (bytes) |
|
4096
|
|
|
|
Compare MC9S12C128CFUE25 with alternatives
Compare MC9S12C64PCFA25 with alternatives