MC9S08SH8MFK
vs
MC9S08SH4CFKR
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
FREESCALE SEMICONDUCTOR INC
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Peak Reflow Temperature (Cel)
260
260
Technology
CMOS
CMOS
Time@Peak Reflow Temperature-Max (s)
40
40
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
2
1
Rohs Code
Part Package Code
QFN
Package Description
4 X 4 MM, 1 MM HEIGHT, MO-220VGGD-6, QFN-24
Pin Count
24
Bit Size
8
JESD-30 Code
S-PQCC-N24
JESD-609 Code
e3
Moisture Sensitivity Level
3
Number of Terminals
24
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
Package Code
QCCN
Package Equivalence Code
LCC24,.16SQ,20
Package Shape
SQUARE
Package Style
CHIP CARRIER
Qualification Status
Not Qualified
RAM (bytes)
256
ROM (words)
4096
ROM Programmability
FLASH
Speed
40 MHz
Supply Current-Max
7.7 mA
Surface Mount
YES
Temperature Grade
INDUSTRIAL
Terminal Finish
MATTE TIN
Terminal Form
NO LEAD
Terminal Pitch
0.5 mm
Terminal Position
QUAD
Compare MC9S08SH8MFK with alternatives
Compare MC9S08SH4CFKR with alternatives