MC9S08RG60CFJE vs MC9S08RE16FJ feature comparison

MC9S08RG60CFJE NXP Semiconductors

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MC9S08RE16FJ Motorola Mobility LLC

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Package Description , LQFP, QFP32,.35SQ,32
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 4 Weeks
Has ADC NO NO
Address Bus Width
Bit Size 8 8
Boundary Scan NO
CPU Family HCS08
Clock Frequency-Max 16 MHz 16 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
Format FIXED POINT
Integrated Cache NO
JESD-30 Code S-PQFP-G32 S-PQFP-G32
JESD-609 Code e3
Length 7 mm 7 mm
Low Power Mode YES
Moisture Sensitivity Level 3
Number of External Interrupts 1
Number of I/O Lines 27 27
Number of Serial I/Os 1
Number of Terminals 32 32
Number of Timers 3
On Chip Data RAM Width 8
On Chip Program ROM Width 8 8
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP LQFP
Package Equivalence Code QFP32,.35SQ,32 QFP32,.35SQ,32
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
RAM (bytes) 2048 1024
ROM (words) 61440 16384
ROM Programmability FLASH FLASH
Seated Height-Max 1.6 mm 1.6 mm
Speed 8 MHz 8 MHz
Supply Current-Max 4.8 mA 4.8 mA
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 1.8 V
Supply Voltage-Nom 3 V 2 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 40 NOT SPECIFIED
Width 7 mm 7 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1
Part Package Code QFP
Pin Count 32
Qualification Status Not Qualified
Temperature Grade COMMERCIAL

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