MC9S08RG32PE
vs
MC9S08RD32FJ
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP,
|
7 X 7 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, MS-026BBA, LQFP-32
|
| Pin Count |
28
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
NO
|
NO
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| Clock Frequency-Max |
16 MHz
|
16 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-PDIP-T28
|
S-PQFP-G32
|
| Length |
36.83 mm
|
7 mm
|
| Number of I/O Lines |
23
|
27
|
| Number of Terminals |
28
|
32
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
LQFP
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
FLATPACK, LOW PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
5.08 mm
|
1.6 mm
|
| Speed |
8 MHz
|
8 MHz
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
1.8 V
|
2 V
|
| Supply Voltage-Nom |
3 V
|
2 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
0.8 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
15.24 mm
|
7 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
2
|
4
|
| Boundary Scan |
|
NO
|
| On Chip Program ROM Width |
|
8
|
| Package Equivalence Code |
|
QFP32,.35SQ,32
|
| RAM (bytes) |
|
2048
|
| ROM (words) |
|
32768
|
| Supply Current-Max |
|
4.8 mA
|
|
|
|
Compare MC9S08RG32PE with alternatives
Compare MC9S08RD32FJ with alternatives